Abstract: Due to the high volume production of mobile phones and computer tablets, the demand for MLCCs (Multilayer Ceramic Chip capacitors) has started to outstrip the supply, especially for custom MLCCs. This is particularly true for Class I MLCCs with special specifications such as high voltage and frequency stability, and for such stringent applications as automotive, military and aerospace. Under this situation, the opportunity for counterfeit OEM and replacement capacitors to enter the supply chain has reached a peak. This is especially true as the majority of MLCCs have no marking and cannot easily be distinguished from their package, which gives unscrupulous vendors opportunities for fraud. This paper introduces several test methods for MLCC compliance verification, namely 1) The effect of DC bias on capacitance, 2 ) Capacitance temperature characteristics, 3) High voltage testing of DCW (Dielectric withstand voltage) and IR (Insulation Resistance), 4) Cross section (Dielectric layer and terminal comparison for flex types), and 5) electron microscope (EDS) material analysis to match known good device chemical composition.

Bio: Dr. Saddow’s research interests are to develop wide-bandgap semiconductor materials for biomedical applications MEMS/NEMS applications. His group has demonstrated the in-vitro biocompatibility of 3C-SiC to numerous cell lines and lately his research has focused on the central nervous system. His ultimate research objective is to develop smart sensors for harsh environments and biomedical applications based on wide band gap semiconductor materials. His main expertise was in the development of a hot-wall CVD growth capability specializing in the growth of SiC epitaxial films on Si substrates. Presently he has pioneered the use of SiC for biomedical applications, having demonstrated that 3C-SiC, which is the cubic form that can be grown heteroepitaxially on Si substrates, is both bio- and hemo-compatible. His group has demonstrated several advanced biomedical devices, such as microelectrode arrays (MEAs), neural probes, in-vivo glucose sensors and impedance-based biosensors. He is also working closely with Global ETS to develop science-based methods to determine the authenticity of electronic components using advanced metrology tools. Secondary Electron Microscopy (SEM), Energy Dispersive X-ray spectroscopy (EDS), and Raman Spectroscopy are being applied to compare suspect samples with known good components. Typically these nondestructive methods can rapidly identify counterfeit components so that they can be removed from the supply chain.